The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Dec. 13, 2022
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Shota Murakami, Anan, JP;

Norikazu Yano, Anan, JP;

Tadaaki Miyata, Yokohama, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/0237 (2021.01); B23K 1/00 (2006.01); B23K 35/30 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0237 (2021.01); B23K 1/0016 (2013.01); B23K 35/3013 (2013.01); B23K 2101/40 (2018.08);
Abstract

A manufacturing method of a light-emitting device includes: preparing a mounting substrate having a mounting surface, the mounting substrate including a first metal pattern arranged on a mounting surface side, a second metal pattern arranged on the mounting surface side inward of the first metal pattern in a plan view, and a third metal pattern arranged on the mounting surface side outward of the first metal pattern in the plan view; arranging a light-emitting element over the mounting surface of the mounting substrate; applying a bonding material to the first metal pattern; and joining a sealing member to at least the first metal pattern of the mounting substrate via the bonding material, the sealing member including a fourth metal pattern with a width greater than or equal to a width of the first metal pattern.


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