The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Sep. 16, 2022
Applicant:

Jabil Inc., St. Petersburg, FL (US);

Inventors:

Ian Jeffery Timmins, St. Petersburg, FL (US);

Babak Zarrin Rafie, St. Petersburg, FL (US);

Youssef Faltone, St. Petersburg, FL (US);

John Finnell, St. Petersburg, FL (US);

Assignee:

Jabil Inc., Petersburg, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 3/36 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01Q 3/36 (2013.01); H05K 1/115 (2013.01); H05K 1/0366 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A mmWave antenna that has particular application to be used in a 5G radio. The antenna includes a thick copper power layer, a first prepreg layer formed on one side of the thick power layer, a signal layer formed on a side of the first prepreg layer opposite to the thick power layer, a second prepreg layer formed on a side of the signal layer opposite to the first prepreg layer and a thin copper power layer formed on a side of second prepreg layer opposite to the signal layer. Microvias extend through the first prepreg layer that electrically couple the thick copper layer to the signal layer and microvias extend through the second prepreg layer that electrically couple the thin copper layer to the signal layer, where the number of microvias extending through the first prepreg layer is less than the number of microvias extending through the second prepreg layer.


Find Patent Forward Citations

Quick Actions:

Timmins, Ian. (2026). Method of improved power integrity for mmwave phased array antennas using microvias (U.S. Patent No. 12683276). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12683276

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