The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Oct. 28, 2022
Kmw Inc., Hwaseong-si, KR;
Duk Yong Kim, Yongin-si, KR;
Kyu Chul Choi, Hwaseong-si, KR;
In Hwa Choi, Yongin-si, KR;
Youn Jun Cho, Hwaseong-si, KR;
Jae Hyun Park, Hwaseong-si, KR;
Kyo Sung Ji, Hwaseong-si, KR;
Hye Yeon Kim, Hwaseong-si, KR;
Chi Back Ryu, Hwaseong-si, KR;
Jeong Hyun Choi, Hwaseong-si, KR;
Jae Ho Jang, Pohang-si, KR;
KMW INC., Hwaseong-si, KR;
Abstract
A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.