The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Dec. 30, 2024
Huike (Singapore) Holding Pte.ltd., Singapore, SG;
Canhong Du, Shenzhen City, CN;
HUIKE (SINGAPORE) HOLDING PTE. LTD., Singapore, SG;
Abstract
Embodiments of the present disclosure provide an ultrasonic fingerprint identification apparatus and a lamination thickness adjustment method therefor, and an electronic device, and relate to the technical field of fingerprint identification. A specific embodiment of the ultrasonic fingerprint identification apparatus comprises: an integrated chip and a piezoelectric transducer, wherein a back surface of the integrated chip is connected to an application layer, and the piezoelectric transducer is located on a surface of the integrated chip. Through excitation of a driving pulse, the piezoelectric transducer transmits an ultrasonic signal to the application layer through the integrated chip, and a signal receiving circuit of the integrated chip receives an ultrasonic echo signal returned from a finger through the application layer. The embodiment can avoid an interference effect of surface defects of a lamination on fingerprint imaging, and improve accuracy of fingerprint identification.