The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Jan. 03, 2024
Ecopia Tech Corporation, Toronto, CA;
Yuanming Shu, Toronto, CA;
Shuo Tan, Campbell, CA (US);
Dawei Zai, Toronto, CA;
Ruijie Deng, Toronto, CA;
Zihao Chen, Toronto, CA;
Andi Dai, Toronto, CA;
ECOPIA TECH CORPORATION, Toronto, CA;
Abstract
Methods and systems for enhancing elevation models with landcover feature data are provided. An example method involves accessing imagery covering an area of interest that contains an above-ground feature, generating, a digital surface model of the area of interest, extracting three-dimensional landcover feature data representing the above-ground feature that contains one or more actual ground-level points at the base of the above-ground feature, and generating a digital terrain model from the digital surface model at least in part by removing the above-ground feature from the digital surface model and filling at least some of the removed area with one or more of the actual ground-level points from the three-dimensional landcover feature data.