The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Mar. 16, 2021
Applicant:
Rockley Photonics Limited, Altrincham, GB;
Inventors:
Assignee:
Rockley Photonics Limited, Altrincham, GB;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/136 (2006.01); B41F 16/00 (2006.01); G02B 6/12 (2006.01); G02B 6/122 (2006.01); G02B 6/132 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); H10D 84/05 (2025.01); H10P 72/70 (2026.01); H10P 95/00 (2026.01); H10W 72/00 (2026.01); H10W 74/01 (2026.01);
U.S. Cl.
CPC ...
G02B 6/136 (2013.01); B41F 16/0046 (2013.01); G02B 6/12 (2013.01); G02B 6/122 (2013.01); G02B 6/132 (2013.01); G02B 6/4207 (2013.01); G02B 6/43 (2013.01); H10D 84/05 (2025.01); H10P 72/74 (2026.01); H10P 95/112 (2026.01); H10W 72/0198 (2026.01); H10W 74/014 (2026.01); H10P 72/7428 (2026.01);
Abstract
A coupon wafer comprising a device coupon () for use in a micro-transfer printing process used to fabricate an optoelectronic device. The coupon wafer includes a wafer substrate (), and the device coupon () is attached to the wafer substrate via a tether () and the tether () is formed from a dielectric material.