The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Jul. 27, 2021
Applicant:

Asia Vital Components Co., Ltd., New Taipei City, TW;

Inventor:

Han-Min Liu, New Taipei City, TW;

Assignee:

ASIA VITAL COMPONENTS CO., LTD., New Taipei City, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01);
U.S. Cl.
CPC ...
F28D 15/046 (2013.01);
Abstract

A heat pipe structure includes a main body. The main body has an internal airtight chamber. At least one capillary structure is disposed on a wall face of the airtight chamber. A working fluid is filled in the airtight chamber. The main body has at least one stress concentration section. A retaining reinforcement member is disposed on the capillary structure corresponding to the stress concentration section for reinforcing the capillary structure and securely retaining the capillary structure on the wall face. When the heat pipe is flexed, bent and deformed, the retaining reinforcement member serves to prevent the capillary structure disposed on the stress concentration section from cracking or damaging.


Find Patent Forward Citations

Liu, Han-Min. (2026). Heat pipe structure (U.S. Patent No. 12680763). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12680763

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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