The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Mar. 10, 2020
U.s. Army Research Laboratory, Adelphi, MD (US);
Eric D. Wetzel, Baltimore, MD (US);
Kevin R. Hart, Milwaukee, WI (US);
Ryan M. Dunn, Belcamp, MD (US);
The United States of America represented by the Secretary of the Army, Washington, DC (US);
Abstract
A thermoplastic filament comprising multiple polymers of differing flow temperatures in a geometric arrangement is described. A method for producing such a filament is also described. Because of the difference in flow temperatures, there exists a temperature range at which one polymer is mechanically stable while the other is flowable. This property is extremely useful for creating thermoplastic monofilament feedstock for three-dimensionally printed parts, wherein the mechanically stable polymer enables geometric stability while the flowable polymer can fill gaps and provide strong bonding and homogenization between deposited material lines and layers. These multimaterial filaments can be produced via thermal drawing from a thermoplastic preform, which itself can be three-dimensionally printed. Furthermore, the preform can be printed with precisely controlled and complex geometries, enabling the creation of a filament or fiber with a wide range of applications. A method is also described for including an interior thread that adds structural reinforcement or functional properties, such as electrical conductivity or optical waveguiding, to the filament.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile