The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Jan. 20, 2021
Applicant:

Ppg Industries Ohio, Inc., Cleveland, OH (US);

Inventors:

Liang MA, Allison Park, PA (US);

Marvin M. Pollum, Jr., Pittsburgh, PA (US);

Calum H. Munro, Gibsonia, PA (US);

Maria S. French, Berkshire, GB;

Allison G. Condie, Valencia, PA (US);

Fabien Mezzanotti, Montesson, FR;

Josiane Léon, Thiers sur Thève, FR;

Hong Li, Mars, PA (US);

Assignee:

PPG Industries Ohio, Inc., Cleveland, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/50 (2006.01); C08K 13/02 (2006.01); C08L 23/22 (2006.01); C09D 5/18 (2006.01); C09D 7/45 (2018.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C09D 123/22 (2006.01); C09K 5/14 (2006.01); H01M 10/653 (2014.01); C08K 3/22 (2006.01); C08K 3/34 (2006.01); C08K 5/11 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08K 13/02 (2013.01); C08L 23/22 (2013.01); C09D 5/18 (2013.01); C09D 7/45 (2018.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C09D 123/22 (2013.01); H01M 10/653 (2015.04); C08K 2003/222 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2296 (2013.01); C08K 3/346 (2013.01); C08K 5/11 (2013.01);
Abstract

The present invention is directed to a composition comprising a thermoplastic polymer and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles having a thermal conductivity of at least 5 W/m·K measured according to ASTM D7984) and a volume resistivity of at least 10 Ω·m (measured according to ASTM D257) and being present in an amount of at least 50% by volume based on total volume of the filler package. The present invention also is directed to coatings comprising a thermal conductivity of at least 0.5 W/m·K (measured according to ASTM D7984) and to substrates, at least a portion of which is coated with such a coating.


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