The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Oct. 20, 2021
Fujifilm Business Innovation Corp., Tokyo, JP;
Sumiaki Yamasaki, Kanagawa, JP;
Kiyohiro Yamanaka, Kanagawa, JP;
Satoshi Kamiwaki, Kanagawa, JP;
Takahiro Ishizuka, Kanagawa, JP;
Yasunobu Kashima, Kanagawa, JP;
Satoshi Inoue, Kanagawa, JP;
FUJIFILM Business Innovation Corp., Tokyo, JP;
Abstract
A pressure sensitive adhesive includes: composite resin particles that contain a styrene resin containing, as polymerization components, styrene and a vinyl monomer other than styrene, and a (meth)acrylate resin containing, as a polymerization component, a (meth)acrylate; and an aqueous solvent containing water, in which a mass ratio of the styrene resin to the (meth)acrylate resin (styrene resin:(meth)acrylate resin) is 80:20 to 20:80, a difference between the lowest glass transition temperature and the highest glass transition temperature of the composite resin particles is 30° C. or more, a melt viscosity of the composite resin particles at 100° C. is 4000 Pa·s or more and 20000 Pa·s or less, and, in a melt viscosity range of the composite resin particles of 4000 Pa·s or more and 20000 Pa·s or less, a slope of a logarithm of the melt viscosity of the composite resin particles relative to a temperature of the composite resin particles is −0.08 or more and −0.04 or less.