The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Feb. 25, 2022
Applicant:

Syensqo Specialty Polymers Usa, Llc, Alpharetta, GA (US);

Inventors:

Lindsey Anderson, Cumming, GA (US);

Vijay Gopalakrishnan, Dunwoody, GA (US);

Lee Carvell, Cumming, GA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 69/26 (2006.01); C08G 69/10 (2006.01); C08K 3/40 (2006.01); C08L 77/06 (2006.01); C08K 7/14 (2006.01);
U.S. Cl.
CPC ...
C08G 69/265 (2013.01); C08G 69/10 (2013.01); C08K 3/40 (2013.01); C08L 77/06 (2013.01); C08G 2120/00 (2013.01); C08K 7/14 (2013.01); C08K 2201/002 (2013.01); C08L 2205/025 (2013.01);
Abstract

Described herein is a polyamide composition comprising two polyamides and glass fiber, wherein one of the polyamides is a polyphthalamide formed by polycondensation from various monomers: dicarboxylic acid(s) with diamine(s) and/or amino acid(s), wherein at least one monomer contains a cyclohexyl group. It was surprisingly discovered that the polyamide composition has improved warpage and/or mold shrinkage properties, excellent mechanical performance and high Tg and/or Tm. Due to the excellent performance, the polyamide composition is suitable for molding and can be desirably incorporated into mobile electronic device applications.


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