logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12679778 B1

PDFFull Text
Date of Patent:
Jul. 14, 2026

Filed:

Aug. 30, 2021

Bonded substrate

Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Takashi Ebigase, Nagoya, JP;

Izumi Masuda, Kitanagoya, JP;

Assignee:

NGK INSULATORS, LTD., Nagoya, JP;

Attorney:

MATTINGLY & MALUR, PC

Primary Examiner:

Monique R Jackson

Int. Cl.
CPC ...
C04B 37/02 (2006.01); B23K 1/19 (2006.01); B23K 1/20 (2006.01); B23K 35/00 (2006.01); B23K 35/02 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B23K 101/36 (2006.01); B23K 103/00 (2006.01); B23K 103/12 (2006.01); B23K 103/18 (2006.01); C04B 35/584 (2006.01); C22C 5/08 (2006.01);
U.S. Cl.
CPC ...
C04B 37/026 (2013.01); B23K 1/19 (2013.01); B23K 1/20 (2013.01); B23K 35/007 (2013.01); B23K 35/0233 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); B23K 2101/36 (2018.08); B23K 2103/12 (2018.08); B23K 2103/18 (2018.08); B23K 2103/52 (2018.08); C04B 35/584 (2013.01); C04B 2237/368 (2013.01); C04B 2237/407 (2013.01); C04B 2237/52 (2013.01); C04B 2237/59 (2013.01); C22C 5/08 (2013.01);
Abstract

Electrical insulating properties between adjacent copper plates are improved while a defect of a bonded substrate which is caused by concentration of stress to end portions of the copper plates is prevented. A bonded substrate includes a silicon nitride ceramic substrate, a copper plate, and a bonding layer. The copper plate and the bonding layer are disposed on the silicon nitride ceramic substrate. The bonding layer bonds the copper plate to the silicon nitride ceramic substrate. The bonding layer includes: an interplate portion between the silicon nitride ceramic substrate and the copper plate; and a protruding portion protruding from between the silicon nitride ceramic substrate and the copper plate. Exposure of the silicon nitride ceramic substrate is prevented at a position where the protruding portion is disposed.

Find Patent Forward Citations

Loading…