The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
May. 09, 2024
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Takuro Mita, Kanagawa, JP;
Koji Kawamura, Kanagawa, JP;
Assignee:
CANON KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65H 37/04 (2006.01); B65H 31/30 (2006.01); B65H 39/10 (2006.01);
U.S. Cl.
CPC ...
B65H 39/10 (2013.01); B65H 31/3072 (2013.01); B65H 37/04 (2013.01); B65H 2801/27 (2013.01); B65H 2801/48 (2013.01);
Abstract
A bundling mechanism creates a sheet bundle including N sheets including an M-th sheet to be included in a k-th booklet and a first sheet to be included in a k+1-th booklet. The k is an integer from 1 to L−1. The M is not a multiple of N. A adhesion mechanism bonds together a preceding sheet and a subsequent sheet stacked at a stacker, except for the M-th sheet to be included in the k-th booklet and the first sheet to be included in the k+1-th booklet.