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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12679083 B1

PDFFull Text
Date of Patent:
Jul. 14, 2026

Filed:

Feb. 23, 2021

Peeling system and peeling method for flexible fingerprint component

Applicants:

Beijing Boe Sensor Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Yi Dai, Beijing, CN;

Cheng Li, Beijing, CN;

Yue Geng, Beijing, CN;

Kuiyuan Wang, Beijing, CN;

Chaoyang Qi, Beijing, CN;

Zefei Li, Beijing, CN;

Yajie Feng, Beijing, CN;

Xiaoguan Li, Beijing, CN;

Zhonghuan Li, Beijing, CN;

Assignees:

Beijing BOE Sensor Technology Co., Ltd., Beijing, CN;

BOE Technology Group Co., Ltd., Beijing, CN;

Attorney:

IPro, PLLC

Primary Examiner:

Philip C Tucker

Assistant Examiner:

Nickolas R Harm

Int. Cl.
CPC ...
B32B 43/00 (2006.01); H10P 72/00 (2026.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); H10P 72/0442 (2026.01); Y10T 156/1132 (2015.01); Y10T 156/1168 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1978 (2015.01);
Abstract

In a peeling system and a peeling method for a flexible fingerprint component provided by the present invention, the flexible fingerprint component is formed on a rigid substrate, and the flexible fingerprint component comprises a flexible substrate, a photosensitive device layer and an optical film sequentially arranged on the flexible substrate, a first chip-on film bonded to the photosensitive device layer on a first side of the optical film, and a second chip-on film bonded to the photosensitive device layer on a second side of the optical film, wherein the optical film is provided with an extension portion beyond the flexible substrate, the second side of the optical film is located on a side opposite to the extension portion, and the first side of the optical film is located on a side adjacent to the extension portion.

Find Patent Forward Citations

Dai, Yi. (2026). Peeling system and peeling method for flexible fingerprint component (U.S. Patent No. 12679083). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12679083

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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