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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12679080 B1

PDFFull Text
Date of Patent:
Jul. 14, 2026

Filed:

Mar. 30, 2022

Phenolic panel and attachment/detachment system and process

Applicant:

Temper Ip, Llc, Cedar Springs, MI (US);

Inventors:

Collin J. Saunders, Holland, MI (US);

Luke A. Martin, Wyoming, MI (US);

William C. Dykstra, Rockford, MI (US);

Assignee:

Temper IP, LLC, Rockford, MI (US);

Attorney:

HONIGMAN LLP

Primary Examiner:

Zachary M Davis

Int. Cl.
CPC ...
B32B 27/42 (2006.01); B32B 3/26 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); B32B 15/098 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01); C08J 5/12 (2006.01); C09J 5/06 (2006.01); H05B 6/10 (2006.01); F41H 5/04 (2006.01);
U.S. Cl.
CPC ...
B32B 27/42 (2013.01); B32B 3/266 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 15/043 (2013.01); B32B 15/098 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); C08J 5/128 (2013.01); C09J 5/06 (2013.01); H05B 6/105 (2013.01); B32B 2307/202 (2013.01); B32B 2307/208 (2013.01); B32B 2571/00 (2013.01); B32B 2605/00 (2013.01); C08J 2361/04 (2013.01); F41H 5/0457 (2013.01);
Abstract

A system for attaching a phenolic panel to a metal part includes a phenolic laminate panel having (i) a phenolic panel, (ii) a ferromagnetic susceptor bonded at an inner side of the phenolic panel via higher melting point adhesive and (iii) a non-magnetic shield having an outer side bonded at an inner side of the ferromagnetic susceptor via higher melting point adhesive. A lower melting point adhesive is applied at an inner side of the non-magnetic shield opposite from the outer side of the non-magnetic shield. With the phenolic laminate panel disposed at a metal part, an electromagnetic field is generated at the phenolic laminate panel to heat the phenolic laminate panel to a temperature greater than the melting point of the lower melting point adhesive and less than the melting point of the higher melting point adhesive to bond the phenolic laminate panel to the metal part.

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