The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Mar. 28, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Donghoon Kwon, Suwon-si, KR;

Boun Yoon, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/20 (2012.01); B24B 37/04 (2012.01); B24B 57/02 (2006.01);
U.S. Cl.
CPC ...
B24B 37/205 (2013.01); B24B 37/044 (2013.01); B24B 57/02 (2013.01);
Abstract

A substrate processing apparatus includes a substrate support portion including a platen and a transparent polishing pad on the platen, the platen comprising a light generator that generates light that passes through the transparent polishing pad and proceeds towards a semiconductor substrate on the substrate support portion, and the transparent polishing pad including a surface that contacts and polishes the semiconductor substrate. The substrate processing apparatus further includes: a substrate holder that fixes the semiconductor substrate such that the semiconductor substrate is in contact with the substrate support portion; and a slurry supply portion that supplies slurry between the semiconductor substrate and the transparent polishing pad. The slurry includes a light blocking material that blocks the light; and abrasive particles that are configured to be activated by accepting electrons generated, based on the light, by a photocatalyst within the slurry.


Find Patent Forward Citations

Kwon, Donghoon. (2026). Substrate processing apparatus and substrate processing method (U.S. Patent No. 12678915). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12678915

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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