The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Apr. 15, 2021
Applicant:
Siemens Aktiengesellschaft, Munich, DE;
Inventors:
Assignee:
SIEMENS AKTIENGESELLSCHAFT, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/32 (2014.01); B23K 103/00 (2006.01); H10W 72/00 (2026.01); H10W 72/30 (2026.01);
U.S. Cl.
CPC ...
B23K 26/32 (2013.01); B23K 2103/56 (2018.08); H10W 72/07335 (2026.01); H10W 72/352 (2026.01);
Abstract
Various teachings of the present disclosure include a method for welding an attachment piece to a semiconductor metallization using laser welding. The method may include: arranging an attachment piece having a flat side with a thin point so the flat side faces the semiconductor metallization; and welding the flat side to the semiconductor metallization. The flat side rests against a flat side of the semiconductor metallization over an entire surface area of the flat side. The thin point is formed with a cup shape of the attachment piece. The cup shape is open in the direction away from the semiconductor metallization.