The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2026

Filed:

Dec. 10, 2021
Applicant:

Sodick Co., Ltd., Kanagawa, JP;

Inventors:

Hisahiko Jinno, Kanagawa, JP;

Masato Taniguchi, Kanagawa, JP;

Kazutake Muramoto, Kanagawa, JP;

Assignee:

Sodick Co., Ltd., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A47J 27/21 (2006.01); A23L 5/10 (2016.01); A47J 27/00 (2006.01); A47J 27/18 (2006.01); B08B 9/032 (2006.01);
U.S. Cl.
CPC ...
A47J 27/21166 (2013.01); A23L 5/13 (2016.08); A47J 27/18 (2013.01); B08B 9/0321 (2013.01); A47J 2027/006 (2013.01); B08B 2209/032 (2013.01);
Abstract

A noodle boiling apparatus includes a noodle boiling unit, and a hot water supply mechanism supplying water, which is heated, to the noodle boiling unit. The noodle boiling unit includes a boiling tank storing the water and boiling noodles, a hot water pipe supplying the water, which is heated, to the boiling tank, and a discharge pipe discharging the water from the boiling tank to the hot water supply mechanism. The hot water supply mechanism includes a heat exchanger heating the water to a desired temperature and a circulation pump pumping the water to the heat exchanger. The hot water supply mechanism is configured to circulate the water constantly between the boiling tank and the hot water supply mechanism when the noodles are boiled.


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