The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2026

Filed:

Jun. 30, 2022
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Ramlah Binte Abdul Razak, Plano, TX (US);

Hector Torres, Lucas, TX (US);

Kevin Ziemer, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H01G 4/012 (2006.01); H01G 4/228 (2006.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H01G 4/012 (2013.01); H01G 4/228 (2013.01); H10W 90/759 (2026.01);
Abstract

In examples, a ceramic semiconductor package includes a first semiconductor die; a second semiconductor die; and a ceramic body including a ceramic member. The ceramic member comprises a first conductor on a top surface of the ceramic member and a second conductor. The second conductor includes a first member on the top surface of the ceramic member and separated from the first conductor, the first member coupled to a device side of the first semiconductor die; and a second member coupled to the first member by a vertical member, the second member extending horizontally within the ceramic member parallel to and coinciding vertically with the first conductor, the second member coupled to a device side of the second semiconductor die.


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