The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2026

Filed:

Feb. 03, 2022
Applicant:

Creeled, Inc., Durham, NC (US);

Inventors:

Boris Dzyubenko, Morrisville, NC (US);

Christopher P. Hussell, Raleigh, NC (US);

Florin A. Tudorica, Chapel Hill, NC (US);

Assignee:

CreeLED, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 77/10 (2023.01); H10H 20/01 (2025.01); H10H 20/854 (2025.01); H10H 20/857 (2025.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10H 20/01 (2025.01); H10H 20/854 (2025.01); H10H 20/857 (2025.01); H10H 20/0362 (2025.01); H10H 20/0364 (2025.01);
Abstract

Light-emitting devices including solid-state light-emitting devices, light-emitting diodes (LEDs), and LED packages with reinforcement materials and related methods are disclosed. Reinforcement materials may include fibers and/or particles that are incorporated in various elements of light-emitting devices to provide improved mechanical strength, reduced differences in thermal expansion, improved adhesion between various device elements, modified optical characteristics such as modified far field patterns, and/or improved manufacturability. Reinforcement materials may be provided within support elements on which LED chips are mounted. In certain aspects, the support elements may be light-transmissive to light emitted by the LED chips. Reinforcement materials may also be provided in laminate films are that provided on support elements. Such laminate films may provide build-up structures that form cavities for the LED chip, or the laminate films may conformally cover the LED chips.


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