The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Jul. 23, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
The upper redistribution structure of the semiconductor package includes an upper redistribution insulating layer disposed on a semiconductor chip; a first upper redistribution line pattern extending in a horizontal direction inside the upper redistribution insulating layer; a first upper redistribution via pattern extending in a vertical direction inside the upper redistribution insulating layer and configured to connect plurality of first conductive pads to the first upper redistribution line pattern; a pad line pattern extending in the horizontal direction in an upper portion of the upper redistribution insulating layer and configured to connect plurality of second conductive pads with each other; and a pad via pattern extending in the vertical direction inside the upper redistribution insulating layer and configured to connect at least one of the plurality of first conductive pads to the conductive connection member.