The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Jul. 29, 2020
Mitsubishi Gas Chemical Company, Inc., Chiyoda-ku, JP;
Mitsubishi Gas Chemical Trading, Inc., Chiyoda-ku, JP;
Yukihide Naito, Tokyo, JP;
Kensuke Ohmae, Tokyo, JP;
Hiroshi Matsunaga, Kanagawa, JP;
Satoshi Tamai, Kanagawa, JP;
MITSUBISHI GAS CHEMICAL COMPANY, INC., Chiyoda-ku, JP;
Mitsubishi Gas Chemical Trading, Inc., Chiyoda-ku, JP;
Abstract
The present invention provides: an aqueous composition capable of removing a photoresist from a printed wiring board or a semiconductor wafer while preventing corrosion of tin plating and tin alloy plating in addition to a copper wiring; and a method for removing a photoresist using the aqueous composition. The aqueous composition according to the present invention is characterized by comprising an alkanolamine (A), a quaternary ammonium hydroxide (B), a sugar alcohol (C), a polar organic solvent (D), and water (E), wherein, with respect to the total amount of the composition, the content of the alkanolamine (A) is 2.5-50 mass %, the content of the quaternary ammonium hydroxide (B) is 0.5-4 mass %, and the content of the sugar alcohol (C) is 0.5-20 mass %.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile