The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Mar. 29, 2023
Applicants:
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Stmicroelectronics (Rousset) Sas, Rousset, FR;
Inventors:
Assignees:
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
STMicroelectronics (Rousset) SAS, Rousset, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/20 (2026.01); H10W 20/43 (2026.01); H10W 42/40 (2026.01); H10W 72/90 (2026.01); H10W 74/01 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01); H04L 9/00 (2022.01); H10W 72/50 (2026.01);
U.S. Cl.
CPC ...
H10W 42/405 (2026.01); H10W 20/43 (2026.01); H10W 72/90 (2026.01); H10W 74/012 (2026.01); H10W 74/15 (2026.01); H10W 90/00 (2026.01); H04L 9/002 (2013.01); H10W 72/5473 (2026.01); H10W 90/20 (2026.01); H10W 90/732 (2026.01); H10W 90/754 (2026.01);
Abstract
A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.