The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2026

Filed:

Aug. 07, 2023
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Ker-Yih Kao, Miao-Li County, TW;

Cheng-Chi Wang, Miao-Li County, TW;

Yen-Fu Liu, Miao-Li County, TW;

Ju-Li Wang, Miao-Li County, TW;

Jui-Jen Yueh, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 42/00 (2026.01); H10D 30/67 (2025.01); H10W 70/685 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 42/121 (2026.01); H10D 30/6758 (2025.01); H10W 70/685 (2026.01); H10W 74/117 (2026.01); H10W 90/794 (2026.01);
Abstract

An electronic device includes a chip and a circuit structure layer overlapped with the chip. The circuit structure layer includes a redistribution structure layer and an element structure layer, and the redistribution structure layer and the element structure layer are electrically connected to the chip. At least one of the redistribution structure layer and the element structure layer includes at least one opening, and in a normal direction of the electronic device, the at least one opening is overlapped with aside of the chip.


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