The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2026

Filed:

May. 07, 2025
Applicant:

Auradine, Inc., Santa Clara, CA (US);

Inventors:

Anuya Reddy, Pleasanton, CA (US);

Pranav Kalyanraman, Santa Clara, CA (US);

Assignee:

Auradine, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/73 (2026.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H10W 40/77 (2026.01); H10W 72/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/73 (2026.01); H05K 1/0204 (2013.01); H05K 1/144 (2013.01); H10W 40/77 (2026.01); H10W 72/07152 (2026.01); H10W 90/00 (2026.01); H05K 2201/042 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10522 (2013.01); H10W 90/736 (2026.01);
Abstract

Examples of devices for providing cooling solutions are described. One example device at least one printed circuit board (PCB) and at least one baffle cover positioned along an edge of the at least one PCB. The at least one PCB is immersed in a cooling fluid in a tank. The at least one PCB includes one or more integrated circuit (IC) chips with a thermal interface material (TIM) applied to surfaces of the one or more IC chips that are coupled to a boilerplate. The baffle cover includes one or more openings that are configured to control an agitation of the cooling fluid proximate to the edge of the at least one PCB.


Find Patent Forward Citations

Loading…