The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Oct. 12, 2021
Applicant:
Siemens Aktiengesellschaft, Munich, DE;
Inventors:
Stefan Pfefferlein, Heroldsberg, DE;
Ronny Werner, Nuremberg, DE;
Assignee:
Siemens Aktiengesellschaft, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H01L 23/498 (2006.01); H10W 40/00 (2026.01); H10W 40/73 (2026.01); H10W 70/685 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/73 (2026.01); H10W 40/037 (2026.01); H10W 70/685 (2026.01); H10W 90/734 (2026.01); H10W 90/736 (2026.01);
Abstract
A semiconductor module includes a first substrate, a second substrate having a closed, in particular continuous, hollow chamber structure, and a semiconductor element having a first side connected to the first substrate in a planar manner and a second side which faces away from the first side and is connected to the second substrate in a planar manner. A phase change material is arranged in the hollow chamber structure of the second substrate and in thermally conductive connection with the semiconductor element.