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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12677660 B1

PDFFull Text
Date of Patent:
Jul. 07, 2026

Filed:

Nov. 08, 2023

Semiconductor device

Applicant:

Denso Corporation, Kariya-city, JP;

Inventors:

Yoshifumi Munakata, Kariya-city, JP;

Motomi Murozaki, Kariya-city, JP;

Masahiro Honda, Kariya-city, JP;

Assignee:

DENSO CORPORATION, Kariya-city, JP;

Attorney:

Posz Law Group, PLC

Primary Examiner:

Peniel M Gumedzoe

Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/07 (2006.01); H10W 40/25 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H02P 27/06 (2006.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10W 40/255 (2026.01); H10W 74/127 (2026.01); H10W 90/00 (2026.01); H02P 27/06 (2013.01); H10W 72/884 (2026.01); H10W 90/734 (2026.01); H10W 90/755 (2026.01);
Abstract

A semiconductor device includes a semiconductor element having main electrode on opposite faces in a plate thickness direction, a substrate, and a sealing body. The substrate has an insulating base member, a front-face metal body, and a back-face metal body having an exposed face exposed from the sealing body. A laminate of the insulating base member and the back-face metal body has a side face connecting between a front face of the insulating base member and the exposed face of the back-face metal body. The side face includes a first inclined portion in a predetermined range from the front face and a second inclined portion in a predetermined range from the exposed face. In a plan view of the substrate viewed along the plate thickness direction, a length of the second inclination portion is shorter than a length of the first inclination portion.

Find Patent Forward Citations

Munakata, Yoshifumi. (2026). Semiconductor device (U.S. Patent No. 12677660). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12677660

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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