The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Nov. 15, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Il Geun Jung, Suwon-si, KR;
Sung Jin Kim, Suwon-si, KR;
Sang-Ki Kim, Suwon-si, KR;
Joong Won Shin, Suwon-si, KR;
Sung Yun Woo, Suwon-si, KR;
Sang Hyeon Jeon, Suwon-si, KR;
Ji Min Choi, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor device includes a substrate with first and second surfaces, a first test pad on the first surface of the substrate, a first bump pad on the first surface of the substrate and spaced apart from the first test pad in a first direction, a second bump pad on the first surface of the substrate and spaced apart from the first bump pad, a second test pad on the first surface of the substrate and spaced apart from the second bump pad in the first direction, a first wiring layer in the first direction and electrically connecting the first test pad to the first bump pad, a second wiring layer in the first direction, spaced apart from the first wiring layer, and electrically connecting the second test pad to the second bump pad, and a first bump connected to each of the first and second bump pads.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile