The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2026

Filed:

Apr. 27, 2023
Applicant:

Origin Quantum Computing Technology (Hefei) Co., Ltd, Hefei, CN;

Inventors:

Liangliang MA, Hefei, CN;

Wenshu Liu, Hefei, CN;

Jie Zheng, Hefei, CN;

Nianci Wang, Hefei, CN;

Bing You, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 69/00 (2026.01); G06N 10/40 (2022.01); H01P 3/00 (2006.01);
U.S. Cl.
CPC ...
H10N 69/00 (2023.02); G06N 10/40 (2022.01); H01P 3/003 (2013.01);
Abstract

Disclosed are a quantum chip and a fabrication method therefor. The quantum chip includes a base substrate on which signal transmission lines are formed; and at least one insulating substrate located on the base substrate, where a qubit and a through hole penetrating through the insulating substrate are formed on the insulating substrate, a metal piece is formed in the through hole, and two ends of the metal piece are electrically connected to the signal transmission lines and the qubit, respectively.


Find Patent Forward Citations

MA, Liangliang. (2026). Quantum chip and fabrication method therefor (U.S. Patent No. 12677601). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12677601

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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