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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12677581 B1

PDFFull Text
Date of Patent:
Jul. 07, 2026

Filed:

Dec. 10, 2019

Wrapping perovskite grains with silica shells for improved stability and efficiency of perovskite electronic devices

Applicant:

Nutech Ventures, Lincoln, NE (US);

Inventors:

Jinsong Huang, Lincoln, NE (US);

Yang Bai, Westlake, AU;

Assignee:

NUTECH VENTURES, Lincoln, NE (US);

Attorneys:

Gerald T. Gray

Leydig, Voit & Mayer, LTD.

Primary Examiner:

Golam Mowla

Int. Cl.
CPC ...
H10K 71/12 (2023.01); H10K 30/10 (2023.01); H10K 30/35 (2023.01); H10K 30/50 (2023.01); H10K 30/82 (2023.01); H10K 30/88 (2023.01); H10K 85/50 (2023.01);
U.S. Cl.
CPC ...
H10K 71/12 (2023.02); H10K 30/352 (2023.02); H10K 30/82 (2023.02); H10K 30/88 (2023.02); H10K 85/50 (2023.02); H10K 30/10 (2023.02); H10K 30/50 (2023.02);
Abstract

Systems and methods for enhancing the stability and efficiency of perovskite materials, and devices incorporating such perovskite materials. A method of making a perovskite layer includes mixing a perovskite solution with a silica shell precursor solution to produce a perovskite-silica precursor solution, and spin casting or drop casting the perovskite-silica precursor solution on a substrate to form a perovskite material or material layer, wherein the perovskite material or material layer includes a plurality of groups of one or more perovskite grains, each of said plurality of groups wrapped in a silica shell. The silica shell precursor solution may have a chemical structure of R—Si—(OR), where 'R' is an alkyl, aryl, or organofunctional group, and “OR” is a methoxy, ethoxy, or acetoxy group.

Find Patent Forward Citations

Huang, Jinsong. (2026). Wrapping perovskite grains with silica shells for improved stability and efficiency of perovskite electronic devices (U.S. Patent No. 12677581). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12677581

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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