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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12677376 B1

PDFFull Text
Date of Patent:
Jul. 07, 2026

Filed:

Aug. 02, 2019

Adhesive composition, thermosetting adhesive sheet, and printed wiring board

Applicant:

Dexerials Corporation, Shimotsuke, JP;

Inventors:

Jun Yamamoto, Shimotsuke, JP;

Toshiyuki Minegishi, Shimotsuke, JP;

Kazuhiro Date, Shimotsuke, JP;

Assignee:

DEXERIALS CORPORATION, Shimotsuke, JP;

Attorney:

Oliff PLC

Primary Examiner:

Vivian Chen

Int. Cl.
CPC ...
H05K 3/303 (2026.01); B32B 7/12 (2006.01); B32B 25/08 (2006.01); B32B 27/00 (2006.01); C08L 63/00 (2006.01); C08L 71/12 (2006.01); C09J 7/22 (2018.01); C09J 7/25 (2018.01); C09J 7/35 (2018.01); C09J 7/38 (2018.01); C09J 11/06 (2006.01); C09J 151/08 (2006.01); C09J 153/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 3/305 (2013.01); C09J 7/255 (2018.01); C09J 7/35 (2018.01); C09J 7/381 (2018.01); C09J 153/02 (2013.01); B32B 7/12 (2013.01); B32B 25/08 (2013.01); B32B 27/00 (2013.01); C08L 63/00 (2013.01); C08L 71/12 (2013.01); C09J 7/22 (2018.01); C09J 7/387 (2018.01); C09J 11/06 (2013.01); C09J 151/08 (2013.01); C09J 153/025 (2013.01); C09J 2203/326 (2013.01); C09J 2425/00 (2013.01); C09J 2463/00 (2013.01); C09J 2467/006 (2013.01); C09J 2471/00 (2013.01); H05K 1/03 (2013.01);
Abstract

An adhesive composition has a low dielectric constant, a low dielectric loss tangent, and an excellent folding endurance. The adhesive composition includes: with respect to the total of 100 parts by mass of the adhesive composition, 75 to 90 parts by mass of a styrene elastomer; 3 to 25 parts by mass of a modified polyphenyleneether resin having a polymerizable group at an end; and totally 10 parts by mass or less of an epoxy resin and an epoxy resin curing agent, wherein the styrene ratio of the styrene elastomer is less than 30%.

Find Patent Forward Citations

Yamamoto, Jun. (2026). Adhesive composition, thermosetting adhesive sheet, and printed wiring board (U.S. Patent No. 12677376). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12677376

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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