The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
May. 06, 2021
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Takuya Oshima, Tokyo, JP;
Takashi Morioka, Tokyo, JP;
Assignee:
LINTEC Corportaion, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B 3/12 (2006.01); H05B 3/03 (2006.01); H05B 3/20 (2006.01);
U.S. Cl.
CPC ...
H05B 3/12 (2013.01); H05B 3/03 (2013.01); H05B 3/20 (2013.01);
Abstract
A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a cured product layer supporting the pseudo sheet structure; and a pair of electrodes in direct contact with the conductive linear bodies. The cured product layer is formed from a cured product of a curable adhesive agent, and a storage modulus at 23 degrees C. of the cured product layer is in a range from 5.0×10Pa to 1.0×10Pa.