The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Nov. 28, 2022
Applicant:
Airoha Technology Corp., Hsinchu City, TW;
Inventors:
Assignee:
Airoha Technology Corp., Hsinchu City, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/00 (2006.01); H01S 5/02 (2006.01); H01S 5/02315 (2021.01); H01S 5/02345 (2021.01); H01S 5/02355 (2021.01); H01S 5/026 (2006.01); H01S 5/183 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02345 (2021.01); H01S 5/0215 (2013.01); H01S 5/02315 (2021.01); H01S 5/02355 (2021.01); H01S 5/0261 (2013.01); H01S 5/183 (2013.01);
Abstract
A semiconductor package includes a printed circuit board (PCB), a semiconductor device, a first signal bonding wire, and a first ground bonding wire. The PCB includes a first PCB ground pad and a first PCB signal trace. The semiconductor device includes a first device ground pad and a first device signal pad. The first signal bonding wire is coupled between the first device signal pad and the first PCB signal trace. The first ground bonding wire is coupled between the first device ground pad and the first PCB ground pad, wherein the first ground bonding wire crosses over the first signal bonding wire.