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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12674554 B1

PDFFull Text
Date of Patent:
Jul. 07, 2026

Filed:

Jun. 04, 2025

Circuit board having concave ribbon bonds

Applicant:

Ford Global Technologies, Llc, Dearborn, MI (US);

Inventors:

Aaron Bradley Johnson, Allen Park, MI (US);

Segundo Baldovino, Novi, MI (US);

Michael Robertson, West Bloomfield, MI (US);

Ketan K. Desai, Farmington Hills, MI (US);

Assignee:

Ford Global Technologies, LLC, Dearborn, MI (US);

Attorneys:

Vichit Chea

Price Heneveld LLP

Primary Examiner:

Evan P Dzierzynski

Int. Cl.
CPC ...
F21S 41/19 (2018.01); F21S 41/151 (2018.01); F21S 45/47 (2018.01); F21S 45/49 (2018.01); H05K 1/181 (2026.01); F21Y 103/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21S 41/192 (2018.01); F21S 41/151 (2018.01); F21S 45/47 (2018.01); F21S 45/49 (2018.01); H05K 1/181 (2013.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08); H05K 2201/0382 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/2045 (2013.01);
Abstract

A circuit board assembly has a circuit board with a mounting surface, first and second circuit components mounted on the circuit mounting surface, and first and second concave ribbon bonds extending between the first and second circuit components. The first and second ribbon bonds each have a first end connected to the first circuit component, a second end connected to the second circuit component and a concave portion extending between the first and second ends.

Find Patent Forward Citations

Quick Actions:

Johnson, Aaron. (2026). Circuit board having concave ribbon bonds (U.S. Patent No. 12674554). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12674554

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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