The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2026

Filed:

Jan. 03, 2024
Applicant:

Ycchem Co., Ltd., Seongju-gun, KR;

Inventors:

Seung Chul Hong, Seoul, KR;

Kangsik Myung, Seoul, KR;

Deok Su Han, Seoul, KR;

Han Teo Park, Seoul, KR;

Yongsoo Choi, Seoul, KR;

Assignee:

YCCHEM CO., LTD., Seongju-gun, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/04 (2006.01); A01N 43/80 (2006.01); A01N 59/00 (2006.01); A01N 59/08 (2006.01); A01P 1/00 (2006.01); B24B 37/04 (2012.01); C09G 1/00 (2006.01); C09G 1/02 (2006.01); C09G 1/06 (2006.01); C09K 3/14 (2006.01); C09K 13/00 (2006.01); C09K 13/04 (2006.01); C09K 13/06 (2006.01); H10P 52/40 (2026.01); H10P 95/00 (2026.01);
U.S. Cl.
CPC ...
C09G 1/04 (2013.01); A01N 43/80 (2013.01); A01N 59/00 (2013.01); A01N 59/08 (2013.01); A01P 1/00 (2021.08); B24B 37/044 (2013.01); C09G 1/00 (2013.01); C09G 1/02 (2013.01); C09G 1/06 (2013.01); C09K 3/1436 (2013.01); C09K 3/1454 (2013.01); C09K 3/1463 (2013.01); C09K 13/00 (2013.01); C09K 13/04 (2013.01); C09K 13/06 (2013.01); H10P 52/402 (2026.01); H10P 52/403 (2026.01); H10P 95/062 (2026.01);
Abstract

A composition for semiconductor processing includes polishing particles, water, and a biocide. The biocide includes a first biocide and a second biocide, the first biocide includes a thiazolinone-based compound, and the second biocide includes a chloric acid-based compound.


Find Patent Forward Citations

Hong, Seung. (2026). Polishing composition for semiconductor processing and method of polishing a substrate (U.S. Patent No. 12674077). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12674077

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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