The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2026

Filed:

Aug. 24, 2021
Applicant:

Sekisui Polymatech Co., Ltd., Saitama-city, JP;

Inventors:

Hiromichi Iwazaki, Kounosu, JP;

Kentaro Kiuchi, Saitama-city, JP;

Kenta Kuroo, Shimamotocho, JP;

Hiroki Kudoh, Kawaguchi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); C08K 3/04 (2006.01); C08K 7/04 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); C08K 3/042 (2017.05); C08K 7/04 (2013.01); C08J 2383/05 (2013.01); C08K 2201/001 (2013.01);
Abstract

The present invention is a thermally conductive sheet comprising: a matrix comprising an organic polymer, and a carbon fiber X, the carbon fiber X being oriented in a thickness direction of the sheet, wherein a proportion of a carbon fiber (A) having a fiber length of 100 μm or less is 40% or more and a proportion of a carbon fiber (B) having a fiber length of 200 μm or more is 3 to 13% of the carbon fiber X. According to the present invention, a thermally conductive sheet in which the thermal resistance value is effectively reduced by polishing the surface, resulting in a sheet having a low thermal resistance value can be provided.


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