The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2026
Filed:
Mar. 28, 2023
Seiko Epson Corporation, Tokyo, JP;
Masaya Ishida, Hara, JP;
Momoko Wakabayashi, Hachinohe, JP;
Toshiki Sano, Hachinohe, JP;
Hideki Ishigami, Hachinohe, JP;
Kei Hiruma, Chino, JP;
Seiichi Taniguchi, Asahi, JP;
Kenji Kitada, Shiojiri, JP;
SEIKO EPSON CORPORATION, , JP;
Abstract
Provided is a method for manufacturing a three-dimensional shaped object, the manufacturing method including: a powder layer formation step of disposing powders containing a forming material of the three-dimensional shaped object in a layer shape and forming a powder layer having a predetermined thickness; and a molded body formation step of discharging, to the powder layer, a binder liquid containing a binder for binding the powders to one another, and forming a molded body in which the powders are bound to one another. In the molded body formation step, in a formation region of the molded body in the powder layer, a discharging amount of the binder liquid per unit area to a first formation region that is a contour portion of the formation region and a discharging amount of the binder liquid per unit area to a second formation region other than the contour portion are discharging amounts different from each other.