The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Jul. 24, 2023
Sandisk Technologies, Inc., Milpitas, CA (US);
Rui Yuan, Shanghai, CN;
Zengyu Zhou, Shanghai, CN;
Yihao Chen, Shanghai, CN;
Fen Yu, Shanghai, CN;
Wenbin Qu, Shanghai, CN;
Sandisk Technologies, Inc., Milpitas, CA (US);
Abstract
A thickness of a signal trace on a printed circuit board (PCB) or a substrate is increased by intentionally forming a solder bridge on a surface of the signal trace during a reflow process in which a flip chip die or other computing component is mounted to the PCB or the substrate. Specifically, adjacent interconnects of the flip chip die are coupled to the same signal trace on the PCB or the substrate. During the reflow process, solder associated with each interconnect flows into a space or area defined by the adjacent interconnects and forms a solder bridge within the space, thereby increasing a thickness of the signal trace.