The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Oct. 03, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A package substrate includes a base insulating layer, a first main line pattern on a first surface of the base insulating layer, a plurality of first conductive pads on the first surface of the base insulating layer, a plurality of first branch line patterns on the first surface of the base insulating layer, the plurality of first branch line patterns extending between the first main line pattern and the plurality of first conductive pads; and a first insulating layer on the first surface of the base insulating layer, the first insulating layer including a plurality of first through grooves. Each of the plurality of first branch line patterns includes a first cut portion, a first segment and a second segment separated from each other by the first cut portion, and the plurality of first through grooves overlap first cut portions.