The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Mar. 30, 2022
Qorvo Us, Inc., Greensboro, NC (US);
Walid Meliane, Plano, TX (US);
Christo Bojkov, Plano, TX (US);
Qorvo US, Inc., Greensboro, NC (US);
Abstract
A die attach system includes a substrate that has scored grooves or into which stud bumps on a die are then inserted. The additional surface area and flow of the stud bumps into the trenches creates a strong mechanical bond that may withstand repeated thermal cycling. In a further exemplary aspect, the substrate may be covered in a first material, the stud bumps may be made from the same first material, a die attachment material may be made from the same first material, and a bottom layer of the die may be made from the same material. This material homogeneity allows for more uniform expansion and contraction during thermal cycling, preventing failure of the mechanical bond.