The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Jul. 12, 2022
Auo Corporation, Hsin-Chu, TW;
Chun Chang, Hsin-Chu, TW;
Hsia-Tsai Hsiao, Hsin-Chu, TW;
AUO CORPORATION, Hsin-Chu, TW;
Abstract
A package structure includes a redistribution structure, a first conductive portion, a second conductive portion and a third conductive portion. The redistribution structure includes a first conductive pad and a second conductive pad. The first conductive portion is electrically connected with the first conductive pad. The second conductive portion is electrically connected with the second conductive pad. The first conductive portion at least partially overlaps the second conductive portion. The third conductive portion and the second conductive portion are located at the same layer. The third conductive portion does not overlap any conductive portion which is located at the same layer as the first conductive portion.