The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Apr. 21, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Byung Ju Kang, Suwon-si, KR;

Pan Jae Park, Suwon-si, KR;

Ji Wook Kwon, Suwon-si, KR;

Chul Hong Park, Suwon-si, KR;

Jae Seok Yang, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/41 (2026.01); G06F 30/31 (2020.01); H10D 30/43 (2025.01); H10D 30/67 (2025.01); H10D 62/10 (2025.01); H10D 84/83 (2025.01); H10D 84/85 (2025.01); H10D 89/10 (2025.01); H10W 20/20 (2026.01); H10W 20/40 (2026.01); H10W 20/42 (2026.01); H10W 70/63 (2026.01); H10W 70/65 (2026.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10W 20/427 (2026.01); G06F 30/31 (2020.01); H10D 30/43 (2025.01); H10D 30/6735 (2025.01); H10D 62/121 (2025.01); H10D 84/85 (2025.01); H10W 20/20 (2026.01);
Abstract

A semiconductor device is provided. The semiconductor device includes a substrate including a first side and a second side that are opposite to each other, a power tap cell in a first row, a second row adjacent to the first row, and a third row adjacent to the second row, on the first side of the substrate, a first power rail and a second power rail on the power tap cell, that extend in a first direction and are spaced apart from each other in a second direction, and a power delivery network on the second side of the substrate. The power tap cell includes a first power through via that penetrates the substrate and extends from the power delivery network to the first power rail, and a second power through via that penetrates the substrate and extends from the power delivery network to the second power rail.


Find Patent Forward Citations

Kang, Byung. (2026). Semiconductor device with power tap cells, power rails, and power delivery network connected by through vias (U.S. Patent No. 12672536). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12672536

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…