The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Jul. 26, 2023
Resonac Corporation, Tokyo, JP;
Motoo Aoyama, Tokyo, JP;
Masataka Nishida, Tokyo, JP;
Abstract
A method for producing a semiconductor device includes: a step A of selecting an expandable tape including a base material film and a pressure-sensitive adhesive layer, the tape having a 90° peel strength of the layer to a stainless plate larger than a 180° peel strength; a step B of preparing a laminate including the tape and a plurality of semiconductor chips having first main surfaces; a step C of expanding intervals between the plurality of chips by stretching the tape while heating the tape; and a step D of transferring the plurality of chips onto a pressure-sensitive adhesive layer of another tape of a same type as the tape and peeling the tape at a peeling angle of more than 90° with respect to the first main surfaces of the plurality of chips. The step C and step D are repeated one or more times.