The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Nov. 14, 2023
Hermes-epitek Corporation, Taipei City, TW;
Shang-Jr Gwo, New Taipei City, TW;
Ching-Wen Chang, Kaohsiung City, TW;
Hermes-Epitek Corporation, Taipei City, TW;
Abstract
A heating apparatus includes a placement surface to place a wafer and a heating unit composed of resistance-heating elements, a first conductive component, and a second conductive component. The resistance heating elements are vertically stacked and spaced apart from each other, with each being parallel to the placement surface. In addition, the resistance heating elements are connected in parallel through the first and the second conductive components. A pretreatment method includes the steps of heating a wafer with the heating apparatus in a vacuumed chamber, and feeding a reactant gas into the chamber so that the reactant gas reacts with the surface of the wafer.