The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Nov. 02, 2023
Applicant:
Auo Corporation, Hsinchu, TW;
Inventors:
Yi-Hsin Lin, Hsinchu, TW;
Wen-Lung Chen, Hsinchu, TW;
Assignee:
AUO Corporation, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/854 (2025.01); H10H 20/01 (2025.01); H10H 20/853 (2025.01); H10H 20/857 (2025.01); H10P 72/70 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10H 20/854 (2025.01); H10W 90/00 (2026.01); H10H 20/0362 (2025.01);
Abstract
A display panel includes a circuit substrate, a first supporting structure, a glue layer residue and light-emitting diodes. The circuit substrate has electrodes. The first supporting structure is located outside the electrodes on the circuit substrate. The glue layer residue is located on the first supporting structure. The light-emitting diodes are electrically connected to the electrodes.
Lin, Yi-Hsin. (2026). Method of transferring micro-leds on circuit substrates, removing support structure and grinding edge of circuit substrate (U.S. Patent No. 12672405). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12672405
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile