The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Oct. 05, 2023
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Futoshi Yoshida, Yongin-si, KR;

Jong Hyup Kim, Yongin-si, KR;

Jin Pyung Lee, Yongin-si, KR;

Chung Sic Choi, Yongin-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/01 (2025.01); G01L 1/24 (2006.01); G06T 7/62 (2017.01); G06T 7/90 (2017.01); H10H 20/857 (2025.01); H10W 72/00 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10H 20/01 (2025.01); G01L 1/24 (2013.01); G01L 1/247 (2013.01); G06T 7/62 (2017.01); G06T 7/90 (2017.01); H10H 20/857 (2025.01); H10W 90/00 (2026.01); G06T 2207/10024 (2013.01); G06T 2207/10056 (2013.01); G06T 2207/30148 (2013.01); H10H 20/0364 (2025.01); H10W 72/07141 (2026.01); H10W 72/07183 (2026.01); H10W 72/07307 (2026.01); H10W 72/07332 (2026.01); H10W 90/734 (2026.01);
Abstract

The disclosure provides a pressure detection method of a bonding device and a bonding system. The pressure detection method of a bonding device includes forming a backplane substrate including a light emitting element, disposing a pressure detection sheet on the backplane substrate, transferring the backplane substrate and the pressure detection sheet into a chamber, bonding the light emitting element by pressurizing the pressure detection sheet, photographing the pressure detection sheet, and detecting a color developing area of the pressure detection sheet. In the pressure detection method of the bonding device and the bonding system, it can be inspected whether uniform pressure is applied to a pressure detection sheet.


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