The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Nov. 12, 2021
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventor:

Shunsuke Maruyama, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H10F 39/12 (2025.01); H10F 39/18 (2025.01); H10W 72/90 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10F 39/811 (2025.01); H10F 39/018 (2025.01); H10F 39/182 (2025.01); H10F 39/1843 (2025.01); H10F 39/199 (2025.01); H10W 72/952 (2026.01); H10W 90/792 (2026.01);
Abstract

Provided is a solid-state imaging device that includes a first semiconductor layer including a first photoelectric conversion element that photoelectrically converts light to a signal charge, and a charge holding region that holds the signal charge, a second semiconductor layer on the first semiconductor layer with a first insulating layer interposed therebetween and includes a second photoelectric conversion element that photoelectrically converts light, a circuit substrate unit on the second semiconductor layer with a second insulating layer interposed therebetween and includes a readout circuit that reads out the signal charge, an element-side first metal pad on the second insulating layer, a circuit-side first metal pad on the circuit substrate unit and is connected to the readout circuit and bonded to the element-side metal pad, and a first contact electrode that penetrates the first and second insulating layers and electrically connects the charge holding region and the element-side first metal pad.


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