The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Nov. 19, 2021
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventor:

Tomohiro Ohkubo, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
H10F 39/809 (2025.01); H10F 39/018 (2025.01); H10F 39/026 (2025.01); H10F 39/811 (2025.01);
Abstract

The present technology relates to an imaging device, an electronic device, and a manufacturing method capable of evaluating a chip at a desired timing. The imaging device includes: a first semiconductor chip; and a second semiconductor chip stacked on the first semiconductor chip, in which at least one surface of side surfaces of the first semiconductor chip and at least one surface of side surfaces of the second semiconductor chip are on the same plane. The first semiconductor chip includes a first structure having a ring-shape, and the second semiconductor chip is disposed at a position straddling the first structure on the first semiconductor chip. The present technology can be applied to, for example, an imaging device in which a plurality of semiconductor chips is stacked.


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