The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Jan. 04, 2024
Applicant:
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Inventors:
Ross K. Wilcoxon, Cedar Rapids, IA (US);
Jeremiah D. Wolf, Atkins, IA (US);
Assignee:
Rockwell Collins, Inc., Cedar Rapids, IA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2026.01); H01Q 1/02 (2006.01); H01Q 1/22 (2006.01); H01Q 3/36 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H01Q 1/02 (2013.01); H01Q 1/22 (2013.01); H01Q 3/36 (2013.01); H05K 7/20509 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10522 (2013.01);
Abstract
A packaging architecture for a high frequency active electronically scanned array is described. The packaging architecture enables the thermal management benefits of a card-fed approach to be extended to higher-frequency AESA to operate with higher output power and/or duty cycle. The packaging architecture includes circuit cards that are non-rectangular in shape to provide room for thermal management solutions that are placed between adjacent circuit cards.