The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Apr. 27, 2022
Applicants:

Chongqing Boe Display Technology Co., Ltd., Chongqing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Rui Wang, Beijing, CN;

Ming Hu, Beijing, CN;

Haijun Qiu, Beijing, CN;

Juntao Chen, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G09G 3/3233 (2016.01); H10K 59/121 (2023.01); H10K 59/131 (2023.01);
U.S. Cl.
CPC ...
G09G 3/3233 (2013.01); H10K 59/1213 (2023.02); H10K 59/1216 (2023.02); H10K 59/1315 (2023.02); G09G 2310/08 (2013.01); G09G 2320/0233 (2013.01);
Abstract

The present disclosure provides a display panel and a display device. The display panel includes: a base substrate, a first active layer on a side of the base substrate, and a third conductive layer on a side of the first active layer away from the base substrate. The first active layer includes active portions spaced apart, wherein each active portion includes a sub-active portion and a via-hole connection portion connected to each other, and the sub-active portion is disposed corresponding to a transistor of two or more transistors, and configured to form a channel region of the corresponding transistor. The third conductive layer includes at least one bridge portion, wherein the at least one bridge portion is connected to via-hole connection portions in different active portions through via holes, respectively. A sheet resistance of the third conductive layer is less than a sheet resistance of the via hole connection portion.


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